Institute of Circuit Technology Annual Symposium 2007 National Physical Laboratory (NPL) Teddington.
(Members Only - Password controlled access to report & presentations).

• Symposium report.
  Submitted by: Pete Starkey.

• Future Trends in Interconnection Technology
  Presented by: Professor Martin Goosey.

• Boundary Scan Technology.(powerpoint show file 2.1Mb).
  Presented by: Karl Miles, (Cimbiam UK Ltd/Goepel Electronic Ltd).

• PCB Transmission Line Losses.(powerpoint 2.9Mb).
  Presented by: Mike Johnson ( Conductive Ink Technology - CIT).

• Trends in Flexi-Rigid Manufacture. (Mb).
  Presented by: Dennis Price, (Merlin Circuit Technology Ltd).

• Assembly and Soldering of Flex Circuits with Lead Free Alloys.(pdf 2.8Mb).
  Presented by: Bob Willis (Askbobwillis.com).

• Introduction of IPC-6011 Certification.(pdf 0.7Mb).
  Presented by: Len Pillinger, (BSI Product Services).

• Implications of EU REACh Legislation. (pdf 1.5Mb).
  Presented by: Mike Inman, (BSI Product Services).

• Can Thermo-plastic PCB Materials meet WEEE Requirements.(pdf 0.9Mb).
  Presented by: Martin Wickham, (NPL).