Reliability designed, Reliability delivered
Reliability designed, Reliability delivered
EIPC in association with DfR Solutions Date: Monday 17 & Tuesday October 18, 2011 Location: Enthone Ltd., Woking, Surrey, UK Monday October 17, 2011 Outline Workshop on Design for Manufacturing (DfM): l
Module 1: Introductions l
Module 2: Industry Standard Design Rules l
Module 3: Overview of DfM tasks l
Module 4: DfM- Component l
Module 5: DfM- Printed Circuit Board l
Module 6: DfM- Solder Tuesday October 18, 2011 Outline Workshop on Next Generation Technologies in Electronic Packaging and Production l
Module 1: Component Packaging l
Module 2: Printed Board l
Module 3: Assembly l
Module 4: Thermal Solutions Who should attend? Design Personnel (managers and engineers), Product Personnel (managers and engineers), Reliability Personnel (managers and engineers), and Executives responsible for insertion of new technologies.
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