Nickel gold is one of the most popular surface finishes used in the PCB assembly industry with many advantages but also process and reliability issues. Although the finish has been used successfully for many years in many industries, particularly in high reliability applications it can exhibit a dark secret, intermittent or complete failure of the solder joint. To find out more and see how different companies tackle the problems associated with “Black Pad” join us for this online seminar.
Speaker Topics will include:
Successful nickel gold application methods PCB suppliers control and monitoring methods Failure modes and how to detect them Users views on the benefits of the process Current research projects on process improvements
The seminar will last approximately 3hrs, with presentations every 30min by different speakers, including question and answer sessions. There is no need to miss any of the speakers as registered delegates can select any of the presentations to watch live on the day or online at their leisure after the event at a time that is convenient to them.
Delegates will also receive a copy of all of the presentation slides, a guide to different PCB surface finishes and have access to a bibliography list of many of the technical reports on nickel gold process and joint failures
