|
|
NEW! Improve PCB fabrication yield through an advanced copper activation and cleaning system with automatic process control.
|
|
|
Get information on latest developments on copper activation in PCB fabrication at the sponsored dedicated Workshop at Productronica
|
|
|
|
|
 |
|
Date: November 17, 2011
Time: 10:30-12:45 hrs
Location: Messe München International, Room B21 (above hall B2)
Address: Messegelände, 81823 München, Germany
|
|
Programme highlights:
- Introduction copper activation in PCB fabrication
- Copper activation chemistry versus copper cleaning system from one supplier
- The copper activation system: Equipment, Chemistry and Know-How
- Waste Treatment of processing chemistry
- Copper activation processes for pre-lamination cleaning for etch resist
- Copper activation processes for pre-lamination cleaning for plating resist
- Copper activation of ML-inner-layer before pressing
- Copper activation processes before applying solder mask
- Calibration of Central Processor Unit based on chemistry and products that are manufactured
- How to combine used equipment with the advanced copper activation
system
- Typical technical specification of the advanced copper activation system for different application
- User experience with the new system
- Value in Use of the Cu-Activation System
- Q & A
|
|
|
Dedicated workshop at Productronica 2011 in Munich
Registration is free of charge. Make your reservation soon to ensure a confirmed registered seat at the workshop.
Download here the registration form.
Download here the workshop programme.
|
|
|
|
For more information: EIPC Services BV, Bourgognestraat 16, NL-6221 BX Maastricht
Tel: +31-43-3440872, Email:
This email address is being protected from spambots. You need JavaScript enabled to view it.
, www.eipc.org
|
|
|
|
|
