ICT Journal

Prepared by the ICT with technical papers and news regarding the Institute

Volume 3 No 2 In this issue: Papers on "Advancements in Laser Direct Imaging for Solder Mask Applications", "Packaging and Interconnection for Electronics and Sensors –
Past, Present and Future" and "Measuring Package On Package — Possible Procedure". Obituary - Bernard Coles.
Volume 3 No 1 In this issue: RoHS and REACh updates. Book review "Printed Circuits Handbook - 6th Edition". Reports from Darlington Seminar, IeMRC Workshop and Arundel Seminar. An Innovation in Horizontal Processing Part 2.
Volume 2 No 4 In this issue: REACh - Implications of Europe's New Chemicals Policy on PCB Fabricators and Assemblers. An Innovation in Horizontal Processing Part 1. New Developments in PCB and Interconnect Manufacturing.
Volume 2 No 3 In this issue: Overview of European Commission FP7 proposal - Solderable Finishes. ROHS2 update. Report on 35th ICT Annual Symposium. Review of "Nanopackaging - Nanotechnologies and Electronic Packaging", a new book by James E Morris. Review of EIPC Summer Conference held in Austria. Introduction to "SURFENERGY" - a new European project to help the PCB and Surface Finishing Sectors.
Volume 2 No 2 In this issue: Standards update from Len Pillinger. Review of the ICT Darlington Seminar. Paper on the "Degradation of Chemical Water Pollutants using Ultrasound" Membership news and an update on Group Members.
Volume 2 No 1 This Issue has an update to the Legislation and Standards Digest. A comprehensive list of Acronyms and Abbreviations. A Paper on "Embedded Passive Components". A review of the Technology and Imaging seminar held in Arundel, November 2008. A table of Group Members of the Institute and News from the Membership Secretary.
Volume 1 No 4 Technical news and updates on legislation. Papers on: "A software tool for predicting the thermal performance of embedded components", "EMI shielding properties of polymer composites" and "PCB solderability changes with time - What finish is best". Also Annual Conference and Plating Technology Seminar reports.
Volume 1 No 3 This is the third ICT Journal of 2008, with an update on RoHS and REACh legislation. The papers in this issue cover PCB design, whiskers on lead free solder and integrating Optical connections on pcb's .
Volume 1 No 2 This is the second ICT Journal of 2008, with three papers, including an interesting look at 'PCB's on the Cheap' by the late Dave Kingsley. We have also included write-ups of our last two Seminars. We are looking for feedback, good or bad! Let us know what you think and feel free to forward anything you think would be of interest to Members.
Volume 1 No 1 This is the first issue of a new concept ICT Journal. The Journal contains news about the institute, a review of our annual symposium and two technical papers.
Circuit World, Volume 31, Number 3, 2005. (pdf 5.5Mb).
Circuit World, Volume 31, Number 2, 2005. (pdf 2.6Mb).