New release: IPC-T-50J
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and microvia technology. Also includes commonly used industry acronyms. 121 pages. Released 2011.
If you wish to order the above (or other) IPC standard please go to the EIPC website and click on the section Publications/IPC Standards for more information.
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