EIPC Speednews issue 41 Dec 2011

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Dear Reader, December 2011

We have pleasure in sending you Issue 41 of EIPC Speednews

and trust that you may find something of interest therein.

In this issueNews from EIPC
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-Christmas Greetings!News for France
Read more
-Publication de l'IPC-A-610E-FR : Exigences de l'industrie relatives à l'acceptabilité des assemblages électroniques mises à jour et traduites en françaisNews from the UK
Read more

-BPA announces new comprehensive report- Metal in the Board

-Institute of Circuit Technology: 2012 Annual Foundation Course in PCB DESIGN and MANUFACTURE

-Growth in Printed Electronics

News from the USA
Read more
-How much strain can a package take? Spherical Bend Tests within IPC/JEDEC-9707 Can Reduce Mechanical Failures
-Advances in Lead-Free Alloys, Reliability, Halogen-Free and Counterfeit Components Highlight IPC APEX EXPO 2012 Technical Conference: New Track on Printed Electronics
-IPC Expands Communications Industry-Wide with Introduction of New E-Publication IPC Outlook

Forthcoming events 2012

Click here to read the complete SpeedNews Issue 41

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JPCA-EB01- Edition 4 - 2011

New! Latest edition 2011 Standard from Japan on Embedded Devices.
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