| Title |
Author |
Journal |
Date |
| Study on Wet Chemical Etching of Flexible Printed Circuit Board with 16‑μm Line Pitch, |
Hui Li, Wuhan University. |
Vol 16 No 4 |
Oct 23 |
| Digital and Environmental Circuit Board Manufacturing Based on Continuous Laser Assisted Deposition |
Michael Zenou, ioTech Group Ltd |
Vol 16 No 4 |
Oct 23 |
| Understanding Electroless Nickel Thickness in ENIG and ENEPIG |
Robert Weber, Fischer Technology Inc. |
Vol 16 No 4 |
Oct 23 |
| Reassessing Surface Finish Performance for Next Generation Technology - Part 1. MacDermid Alpha Electronics Solutions |
Frank Xu |
Vol 16 No 3 |
Jul 23 |
| Photoresist Adhesion Promoter for HDI-PCB Fabrication. Atotech Deutschland GmbH |
Christopher Seidemann |
Vol 16 No 3 |
Jul 23 |
| The Challenges in Selective Soldering and Meeting Training Needs. Pillarhouse International Ltd |
Sam McMaster |
Vol 16 No 3 |
Jul 23 |
| Practical Aspects of Selective Etching for High Density Interconnect |
Don Ball |
Vol 16 No 2 |
Apr 23 |
| Thermal Management in High Performance RF and Microwave PCB's |
John Priday |
Vol 16 No 2 |
Apr 23 |
| Two-Layer Solder Resist Film for High Reliability |
Ying Hsuan Chou |
Vol 16 No 2 |
Apr 23 |
| Treatment of Polymeric Films Used for Printed Electronic Circuits Using Non-Thermal Plasma |
Radu Burlica |
Vol 16 No 2 |
Apr 23 |
| IPC Warning about Microvia Reliability for High Performance Products |
Happy Holden |
Vol 16 No1 |
Jan 23 |
| Process Improvement Strategies for Weak Microvia Interfaces |
William Bowerman |
Vol 16 No1 |
Jan 23 |
| Ultra Thin Base Materials Take PCB Manufacturing to the Next Level |
Daniel Schulze |
Vol 16 No1 |
Jan 23 |
| Computer Aided Engineering Simulation for Production Proofing PCB Copper Plating |
Robrecht Brelis |
Vol 16 No1 |
Jan 23 |
| Synthetic Graphite: A New Solution for PC Board Thermal Management |
John Priday |
Vol 15 No 3 |
Oct 22 |
| Selective Soldering: A need for Innovation and Development |
Samuel McMaster |
Vol 15 No 3 |
Oct 22 |
| Solder Joint Reliability in Light Emitting Diode Modules |
Martin Goosey |
Vol 15 No 3 |
Oct 22 |
| How Flexible Printed Circuit Technology is Enabling Cell-to-Pack EV Batteries |
Philip Johnston |
Vol 15 No 2 |
Jun 22 |
| Thin High Phosphorous Electroless Nickel for 5G |
Matt Sylvestre |
Vol 15 No 2 |
Jun 22 |
| Knowledge Exchange - Coventry University Industry Partnership |
Helen Lau |
Vol 15 No 2 |
Jun 22 |
| The Power Mesh Architecture for PCBs |
Happy Holden |
Vol 15 No 1 |
Mar 22 |
| Microvia Process Guidelines |
Stan Heltzel |
Vol 15 No 1 |
Mar 22 |
| UL Solder Limits – The Latest Update on What the Future Holds |
Emma Hudson |
Vol 14 No 3 |
Oct 21 |
| PCB Solderability Assessment - During and Pre-Production |
Bob Willis |
Vol 14 No 3 |
Oct 21 |
| New PCB Material for Demanding High Temperature and High Voltage Requirements of the Rapidly Growing Automotive EV Market |
Anna Graf and Michael J Gay |
Vol 14 No 2 |
Aug 21 |
| Choosing the Right Materials is Tougher Than Ever |
Mark Goodwin |
Vol 14 No 2 |
Aug 21 |
| Ultra Low Profile Copper for Very Low Loss Material |
Thomas Devahif |
Vol 14 No 2 |
Aug 21 |
| 5G Driving High-Performance Material Demand |
Alun Morgan |
Vol 14 No 1 |
Mar 21 |
| 5G+ Readiness and Challenges |
Stig Källman |
Vol 14 No 1 |
Mar 21 |
iNEMI Projects and Initiatives
Address 5G/mmWave Challenges |
Urmi Ray and Steve Payne |
Vol 14 No 1 |
Mar 21 |
| 3D Printing of Electronic Systems for Real World Applications |
Robert Kay and Matthew Shuttleworth |
Vol 14 No 1 |
Mar 21 |
| A Second Life for Electric Vehicle (EV) Batteries |
Martin Goosey |
Vol 13 No 3 |
Dec 20 |
| A Market Research Project in Industrial Applications for a University Developed Technology - SMMF |
Sofya Danilova |
Vol 13 No 3 |
Dec 20 |
| Inkjet Printing of Polyacrylic Acid-Coated Silver Nanoparticle Ink onto Paper with Sub-100 Micron Pixel Size |
Mavuri, Mayes and Alexander |
Vol 13 No 3 |
Dec 20 |
| Selective Metalisation Using a Magnetic Field Technology |
Sofya Danilova |
Vol 13 No 3 |
Dec 20 |
| Shrinking Medical Labs onto Printed Circuit Boards for Disease Management |
Despina Moschou |
Vol 13 No 2 |
Sep 20 |
| Fully Biocompatible Epoxy Acrylate Dry Film for MEMS, Lab-on-chip, Microfluidic and Medical Devices |
Giorgio Favini |
Vol 13 No 2 |
Sep 20 |
| Development and processing of an ink jettable soldermask and advantages of use in PCB manufacture |
Chris Wall |
Vol 13 No 1 |
Mar 20 |
